a) Provide a resistance diagram labeling appropriate variables associated with this problem. b) Determine a symbolic expression for the temperature of the chip T... c) Calculate the chip temperature for the given
a) Provide a resistance diagram labeling appropriate variables associated with this problem. b) Determine a symbolic expression for the temperature of the chip T... c) Calculate the chip temperature for the given
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter1: Basic Modes Of Heat Transfer
Section: Chapter Questions
Problem 1.10P: 1.10 A heat flux meter at the outer (cold) wall of a concrete building indicates that the heat loss...
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Question
![Approximately 106 discrete electrical components are placed on a single integrated circuit (chip) with
electrical heat dissipation of q = 30,000 W/m². The chip, which is very thin, is exposed to a
dielectric liquid at its outer surface, with ho = 450 W/m²/K and To= 20°C, and is joined to a circuit
board at its inner surface. The thermal contact resistance between the chip and the board is
R = 104 m² K/W, and the board thickness and thermal conductivity are L = 4 mm and
00,0
kb = 0.95 W/m/K, respectively. The other surface of the board is exposed to ambient air for which
hi = 30 W/m²/K and T = 20°C.
a) Provide a resistance diagram labeling
appropriate variables associated with this
problem.
b) Determine a symbolic expression for the
temperature of the chip T.
c) Calculate the chip temperature for the given
parameters.
Coolant
ho
00,01
Air
Too,i hi
三
三
-Chip q Te
-Thermal contact resistance, Re
-Board, kp](/v2/_next/image?url=https%3A%2F%2Fcontent.bartleby.com%2Fqna-images%2Fquestion%2F2587a113-5ca6-415a-ac64-2fd0e756bc9a%2Fce94554f-470b-444a-98dc-76cf2e15241d%2Fzy4s48r_processed.jpeg&w=3840&q=75)
Transcribed Image Text:Approximately 106 discrete electrical components are placed on a single integrated circuit (chip) with
electrical heat dissipation of q = 30,000 W/m². The chip, which is very thin, is exposed to a
dielectric liquid at its outer surface, with ho = 450 W/m²/K and To= 20°C, and is joined to a circuit
board at its inner surface. The thermal contact resistance between the chip and the board is
R = 104 m² K/W, and the board thickness and thermal conductivity are L = 4 mm and
00,0
kb = 0.95 W/m/K, respectively. The other surface of the board is exposed to ambient air for which
hi = 30 W/m²/K and T = 20°C.
a) Provide a resistance diagram labeling
appropriate variables associated with this
problem.
b) Determine a symbolic expression for the
temperature of the chip T.
c) Calculate the chip temperature for the given
parameters.
Coolant
ho
00,01
Air
Too,i hi
三
三
-Chip q Te
-Thermal contact resistance, Re
-Board, kp
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