You are designing an enclosure which houses a PCB. Mounted outside the enclosure on its top is a set of aluminum fins, as seen in the sketch below. The enclosure (and fins) are 150mm deep long. There is no forced airflow. Neglect the thickness of the enclosure walls.  Neglect heat transfer out of the sides and bottom of the enclosure.  If the PCB produces 4000 W/m2: a) Most industrial-grade ICs have a maximum temperature of 85oC. If you must keep your PCB below this what is the maximum thermal resistance from the PCB to the air surrounding the fins?  Assume the air around the fins stays at room temperature. b) If the top of the enclosure (and bottom of the fin base) runs at 50°?, what is the effective thermal conductivity above the PCB? Hint: Because the air inside the enclosure is trapped and heats up, any air properties NOT given below are calculated at the average air temperature (T1+T2)/2. c) What is the temperature at the base of the fins?

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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You are designing an enclosure which houses a PCB. Mounted outside the enclosure on its top is a set of aluminum fins, as seen in the sketch below. The enclosure (and fins) are 150mm deep long. There is no forced airflow.

Neglect the thickness of the enclosure walls.  Neglect heat transfer out of the sides and bottom of the enclosure. 

If the PCB produces 4000 W/m2:

a) Most industrial-grade ICs have a maximum temperature of 85oC. If you must keep your PCB below this what is the maximum thermal resistance from the PCB to the air surrounding the fins?  Assume the air around the fins stays at room temperature.

b) If the top of the enclosure (and bottom of the fin base) runs at 50°?, what is the effective thermal conductivity above the PCB? Hint: Because the air inside the enclosure is trapped and heats up, any air properties NOT given below are calculated at the average air temperature (T1+T2)/2.

c) What is the temperature at the base of the fins?

d) What is the efficiency of the fins?

e) What must the convection coefficient be to eliminate all of the heat? Ignore the area of the base.

HELPFUL INFORMATION
Material
Thermal
Density
Prandti
Melting Point (°C)
Dynamic
Viscosity
(Pa - S)
Kinematic
Specific
Latent Heat of
Conductivity
Viscosity (E)
(#)
Heat (2 Fusion
kgK.
Number
Air
0.025
1.25
16.84E-
1.85E-5
0.72
720
Nitric Acid
0.29
1500
3.5E-3
2.3E-6
12
2000
Aluminum
200
2700
Solder
7500
167
59000
220
Equations:
Turbulent Flow in Round Tubes:
Nu = 0.023 Reº.8 p3
Laminar Flow over Flat Plates:
T; = Constant
o Laminar: Nu = 0.664 Re; P
o Turbulent: Nu = 0.037RE.8P/3
q" = Constant
Laminar: Nu = 0.453RE5P
Turbulent: Nu = 0.0308Re*
0.8 p3
Transcribed Image Text:HELPFUL INFORMATION Material Thermal Density Prandti Melting Point (°C) Dynamic Viscosity (Pa - S) Kinematic Specific Latent Heat of Conductivity Viscosity (E) (#) Heat (2 Fusion kgK. Number Air 0.025 1.25 16.84E- 1.85E-5 0.72 720 Nitric Acid 0.29 1500 3.5E-3 2.3E-6 12 2000 Aluminum 200 2700 Solder 7500 167 59000 220 Equations: Turbulent Flow in Round Tubes: Nu = 0.023 Reº.8 p3 Laminar Flow over Flat Plates: T; = Constant o Laminar: Nu = 0.664 Re; P o Turbulent: Nu = 0.037RE.8P/3 q" = Constant Laminar: Nu = 0.453RE5P Turbulent: Nu = 0.0308Re* 0.8 p3
W
hnaturat = 15-
m²K
1.5mm Thick
(6x)
40mm Fins
4mm Base
PCB, q" = 4000-
150mm
80mm
Transcribed Image Text:W hnaturat = 15- m²K 1.5mm Thick (6x) 40mm Fins 4mm Base PCB, q" = 4000- 150mm 80mm
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