Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 3, Problem 12RQ
To determine
The types of engineering materials, having ionic and covalent bonds.
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1. The bonds in those materials are cross- linked but they have a low cross linked density.
a) What are the defining characteristics of elastic behavior? (b)
The bonding energy diagrams for two materials are shown
below. Note that the equilibrium bond lengths are the same for
both materials. Draw the interatomic force diagram for material
#1 and material #2 on the same graph and explain which will
exhibit a higher modulus? Briefly justify your answer?
Material #1
Material #2
ro
ro
Discuss the effect of temperature change on interatomic bonds in terms of the type of material. Evaluate the effects of the differences on the thermal analysis data.
Chapter 3 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 3 - What enables us to control the properties and...Ch. 3 - Â What are the next levels of structure that are...Ch. 3 - Prob. 3RQCh. 3 - Prob. 4RQCh. 3 - Prob. 5RQCh. 3 - Prob. 6RQCh. 3 - What are the three types of primary bonds, and...Ch. 3 - What are some general characteristics of...Ch. 3 - Prob. 9RQCh. 3 - Prob. 10RQ
Ch. 3 - Prob. 11RQCh. 3 - Prob. 12RQCh. 3 - Prob. 13RQCh. 3 - What are some unique property features of...Ch. 3 - Prob. 15RQCh. 3 - Prob. 16RQCh. 3 - Prob. 17RQCh. 3 - What are some of the general characteristics of...Ch. 3 - Prob. 19RQCh. 3 - Prob. 20RQCh. 3 - Prob. 21RQCh. 3 - Prob. 22RQCh. 3 - Prob. 23RQCh. 3 - Prob. 24RQCh. 3 - What is a grain? A grain boundary?Ch. 3 - Prob. 26RQCh. 3 - What is implied by a low ASTM grain�size number?...Ch. 3 - Prob. 28RQCh. 3 - What is Poissons ratio, and under what conditions...Ch. 3 - What is plastic deformation?Ch. 3 - Why do metals retain their strength during plastic...Ch. 3 - Prob. 32RQCh. 3 - Prob. 33RQCh. 3 - What is a dislocation? Using the carpet analogy,...Ch. 3 - What is the difference between an edge dislocation...Ch. 3 - What are some of the common barriers to...Ch. 3 - Prob. 37RQCh. 3 - What is the mechanism (or mechanisms) responsible...Ch. 3 - Why is a fine grain size often desired in an...Ch. 3 - What is an anisotropic property? Why might...Ch. 3 - What is the difference between brittle fracture...Ch. 3 - How does a metal increase its internal energy...Ch. 3 - What is required in order to drive the...Ch. 3 - How might the lowest recrystallization temperature...Ch. 3 - In what ways can recrystallization be used to...Ch. 3 - What is the major distinguishing feature between...Ch. 3 - What is warm working?Ch. 3 - How can deformation and recrystallization improve...Ch. 3 - Why is grain growth usually undesirable?Ch. 3 - Prob. 50RQCh. 3 - As a result of their ionic or covalent bonding,...Ch. 3 - Prob. 52RQCh. 3 - Prob. 53RQCh. 3 - What is the difference between an intrinsic...Ch. 3 - What is required for electrical conductivity in...Ch. 3 - What is required for electrical conductivity in...Ch. 3 - Brass is an alloy of copper with a certain amount...Ch. 3 - It is not uncommon for processing operations to...Ch. 3 - Polyethylene consists of fibrous molecules of...Ch. 3 - Prob. 5P
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- Increasing the temperature of a semiconductor breaks covalent bonds. For each broken bond, two electrons become free to move and transfer electrical charge. What fraction of the total valance electrons are free to move and what fraction of the covalent bonds must be broken in order that 5×1015 electrons conduct electrical charge in 50 g of silicon?arrow_forwardHeat Treatment and Thermo Mechanical Processes: Normalization, Annealing, Recrystallisation, Ausfirming, Tempering, Hardening, Cold Working, Hot Working of the element boronarrow_forwardWhich of the following are true regarding crystalline and non-crystalline materials at the atomic scale? Select one or more: a. Crystalline materials show no long-range order b. There are an infinite number of crystal systems and lattices possible C. Density of packing is higher for crystalline materials d. Bond energy is lower for noncrystalline materials Materials which are not crystalline are referred to as amorphous Bond length is shorter for crystalline versus noncrystalline materials e.arrow_forward
- Choose the correct answer. A material that has high bond energy and high bond stiffness is expected to have: high Young’s modulus, high melting point, and low coefficient of thermal expansion high Young’s modulus, low melting point, and high coefficient of thermal expansion high Young’s modulus, high melting point, and high coefficient of thermal expansion low Young’s modulus, low melting point, and high coefficient of thermal expansion High tensile strength of a material is usually associated with its: high electrical conductivity high magnetic permeability high hardness none of the above If a material exhibits a predominantly covalent bonding then the material is expected to have: high hardness high stiffness high melting point all of the abovearrow_forwardIn thermal conduction in ceramics and metals, which of the following statements are true? Select one or more: a. Phonons can have arbitrarily high and low energy b. A component of thermal energy is transmitted via phonons c. Phonons are a form of vibrational energy d. Phonons are amplified and strengthened by interaction with lattice defects e. Phonons are scattered and heat transfer reduced with interaction with lattice defects.arrow_forward1.3) State with reason, the type of bonding that occurs in titanium chloride, TiCl. QUESTION 2: INTRODUCTION TO SCIENCE AND ENGINEERING MATERIALS 2.1) Why is it important for mechanical engineers to study material? 2.2) What are the main classes of engineering materials?arrow_forward
- Which of the following statements are true? (This question has more than one correct answer) a. Higher thermal conductivity in metals arises in part from the properties of the free electron model of metals b. Dislocations and imperfections reduce the efficiency of phonon heat transfer c. Significant heat transfer occurs by both phonons and electron energy level excitation in both metals and ceramics d. Dislocations and imperfections increase the efficiency of phonon heat transferarrow_forwardWhich type of bonding between atoms is characterized by the sharing of electrons between two or more atoms? Covalent Ionic Metallic Van Der Waals Please answer the question in the image (explantion not needed)arrow_forwardFactors influence crystal structure for ionic materials What factors influence crystal structure for covalently bonded materialsarrow_forward
- Which of the following statements are true? Select one or more: a. Dislocations and defects make thermal transfer easy due to plastic deformation b. Starting at room temperature, the heat conductivity of ceramics goes generally up with increasing temperature c. Starting at room temperature, the heat conductivity of ceramics goes generally down with increasing temperature d. Dislocations and defects make thermal transfer difficult due to phonon scattering e. Heat transfer in solids occurs mainly by waves of atoms vibrating f. Heat transfer in solids occurs mainly by phononsarrow_forwardBelongs to ductile materials that have molecular bonds that can re-form after exceeding the elastic limit. Choose all that apply -cast iron -low-carbon streel -aluminum -copperarrow_forwardCopper at 500 °C has 1.10×1015 vacancies/cm³. The atomic weight of Cu is 63.55 g/mol and the density at this temperature is 8.96 g/cm³. Avogadro constant NA ~ 6.022×1023 atoms/mol. Boltzmann constant (K) - 8.62×10-³ ev/atom • K. (a) What is the activation energy required to create a vacancy in Cu? (b) Cu is then cooled to 400 °C. What will be the number of vacancies per cubic centimeter? Assume that the change in the density in the cooling is negligible.arrow_forward
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Dislocations and Plastic Deformation; Author: LearnChemE;https://www.youtube.com/watch?v=cpvTwYAUeA8;License: Standard Youtube License