Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
expand_more
expand_more
format_list_bulleted
Concept explainers
Question
Chapter 28, Problem 23QLP
To determine
The speed of a transistor is directly proportional to the width of its polysilicon gate; thus, a narrower gate results in a faster transistor and a wider gate in a slower transistor. Knowing that the manufacturing process has a certain difference for the gate width (say, ± 0.1 μm), how would a designer modify the gate size of a critical circuit in order to minimize its difference in speed? Are there any negative effects of this change?
Expert Solution & Answer
Want to see the full answer?
Check out a sample textbook solutionStudents have asked these similar questions
A siilicon boule has been processed through grinding to provide a cylinder whose diameter = 281 mm and whose length = 899 mm. Next, it will be sliced into wafers 0.8 mm thick using a cut-off saw with a kerf = 0.5 mm. The wafer thus produced will be used to fabricate as many IC chips as possible for the personal computer market. Each IC has a market value to the company of $108. Each chip is square with 17 mm on a side. The processable area of each wafer is defined by a diameter = 265 mm. Estimate the value of all of the IC chips that could be produced (in $), asssuming an overall yield of 84% good product.
How does microchip technology influence the aerospace and automotive industries?
Dive into Microchip's involvement in automotive electronics and safety-critical systems. How are their products used in automotive applications, and what safety standards do they comply with?
Chapter 28 Solutions
Manufacturing Engineering & Technology
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Similar questions
- As a computer manufacturer, your goal is to provide high-quality computers with rapid processing speeds that are nevertheless accessible to the general public at reasonable prices. What is the best way to build a high-quality, speedy machine at a low cost?arrow_forwardHow does microchip design differ from microchip fabrication, and what tools and software are commonly used in microchip design?arrow_forwardSuppose your company has just found $100,000 worth of outdated inventory in an old warehouse (this is the original manufacturing cost). Your boss asks you to consider two options: (1) re-engineer the outdated parts at a cost of $30,000, and ideally resell them for $60,000, or (2) scrap them for $15,000 cash (which is certain) in a second-hand market. What advice would you give your boss? Explain in your own words and give the data that supports your answer.arrow_forward
- Analyze the principles of operation and potential applications of gyroscopic and accelerometer-based input devices, such as those used in gaming controllers and smartphones.arrow_forwardWhat is the significance of microchip reliability testing and failure analysis, especially in critical applications like aerospace and healthcare?arrow_forwardThe maker of a motion-sensing towel dispenser is considering adding new products to enhance offerings in the area of touchless technology. If the company does not expand its product line now, it will definitely do so in 2 years. Assume the interest rate is 10% per year. The amount the company can afford to spend now if the cost 2 years from now is estimated to be $100,000 is closest to: (a) $75,130 (b) $82,640 (c) $91,000 (d) $93,280arrow_forward
- What are advantages and limitations of MPI and FPI?arrow_forward2. With advances in technology, what do you think will be the changes in the contents of a Go-Bag 10 years from now? Cite some significant changes.arrow_forward4. Describe the dimensions: design quality and conformance quality.arrow_forward
arrow_back_ios
SEE MORE QUESTIONS
arrow_forward_ios
Recommended textbooks for you
- Elements Of ElectromagneticsMechanical EngineeringISBN:9780190698614Author:Sadiku, Matthew N. O.Publisher:Oxford University PressMechanics of Materials (10th Edition)Mechanical EngineeringISBN:9780134319650Author:Russell C. HibbelerPublisher:PEARSONThermodynamics: An Engineering ApproachMechanical EngineeringISBN:9781259822674Author:Yunus A. Cengel Dr., Michael A. BolesPublisher:McGraw-Hill Education
- Control Systems EngineeringMechanical EngineeringISBN:9781118170519Author:Norman S. NisePublisher:WILEYMechanics of Materials (MindTap Course List)Mechanical EngineeringISBN:9781337093347Author:Barry J. Goodno, James M. GerePublisher:Cengage LearningEngineering Mechanics: StaticsMechanical EngineeringISBN:9781118807330Author:James L. Meriam, L. G. Kraige, J. N. BoltonPublisher:WILEY
Elements Of Electromagnetics
Mechanical Engineering
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Oxford University Press
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:9780134319650
Author:Russell C. Hibbeler
Publisher:PEARSON
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:9781259822674
Author:Yunus A. Cengel Dr., Michael A. Boles
Publisher:McGraw-Hill Education
Control Systems Engineering
Mechanical Engineering
ISBN:9781118170519
Author:Norman S. Nise
Publisher:WILEY
Mechanics of Materials (MindTap Course List)
Mechanical Engineering
ISBN:9781337093347
Author:Barry J. Goodno, James M. Gere
Publisher:Cengage Learning
Engineering Mechanics: Statics
Mechanical Engineering
ISBN:9781118807330
Author:James L. Meriam, L. G. Kraige, J. N. Bolton
Publisher:WILEY